Uchibori, Chihiro J. : rechercher sur Z-Library

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1

[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - Chip Package Interaction analysis for Cu/Ultra low-k large die Flip Chip Ball Grid Array

Uchibori, Chihiro J., Lee, Michael, Xeufeng Zhang,, Ho, Paul S.

Année:

2008

Langue:

english

Fichier:

PDF, 2.59 MB

english, 2008

2

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Structural effects on Chip Package Interaction and mechanical reliability of Cu/low-k multi-layer interconnects in flip-chip package

Lee, Michael G., Uchibori, Chihiro J.

Année:

2010

Langue:

english

Fichier:

PDF, 411 KB

english, 2010

3

Formation of WSi-based ohmic contacts to n-type GaAs

Takeo Oku, Masaki Furumai, Chihiro J. Uchibori, Masanori Murakami

Journal:

Thin Solid Films

Année:

1997

Langue:

english

Fichier:

PDF, 506 KB

english, 1997

4

InxGa1−xAs ohmic contacts to n-type GaAs with a tungsten nitride barrier

Chihiro J. Uchibori, Y. Ohtani, T. Oku, Naoki Ono, Masanori Murakami

Journal:

Journal of Electronic Materials

Année:

1997

Langue:

english

Fichier:

PDF, 838 KB

english, 1997

5

Formation mechanism of InxGa1−xAs ohmic contacts to n-type GaAs prepared by radio frequency sputtering

Chihiro J. Uchibori, Masayuki Okunishi, T. Oku, A. Otsuki, Naoki Ono, Masanori Murakami

Journal:

Journal of Electronic Materials

Année:

1994

Langue:

english

Fichier:

PDF, 1.35 MB

english, 1994

6

InxGa1-xAs ohmic contacts to n-type GaAs prepared by sputter deposition

Masayuki Okunishi, Chihiro J. Uchibori, T. Oku, A. Otsuki, Naoki Ono, Masanori Murakami

Journal:

Journal of Electronic Materials

Année:

1995

Langue:

english

Fichier:

PDF, 1.52 MB

english, 1995

7

[IEEE 2010 IEEE International Reliability Physics Symposium - Garden Grove (Anaheim), CA, USA (2010.05.2-2010.05.6)] 2010 IEEE International Reliability Physics Symposium - SEILA: Soft error immune latch for mitigating multi-node-SEU and local-clock-SET

Uemura, Taiki, Tosaka, Yoshiharu, Matsuyama, Hideya, Shono, Ken, Uchibori, Chihiro J., Takahisa, Keiji, Fukuda, Mitsuhiro, Hatanaka, Kichiji

Année:

2010

Langue:

english

Fichier:

PDF, 465 KB

english, 2010

8

CD19 target-engineered T-cells accumulate at tumor lesions in human B-cell lymphoma xenograft mouse models

Tsukahara, Tomonori, Ohmine, Ken, Yamamoto, Chihiro, Uchibori, Ryosuke, Ido, Hiroyuki, Teruya, Takeshi, Urabe, Masashi, Mizukami, Hiroaki, Kume, Akihiro, Nakamura, Masataka, Mineno, Junichi, Takesako,

Journal:

Biochemical and Biophysical Research Communications

Année:

2013

Langue:

english

Fichier:

PDF, 1.23 MB

english, 2013

9

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Impact of chip package interaction on Cu/Ultra low-k interconnect delamination in Flip Chip Package with large die

Uchibori, Chihiro J., Lee, Michael

Année:

2009

Langue:

english

Fichier:

PDF, 586 KB

english, 2009

10

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Investigation of Mechanical Reliability of Cu/low-k Multi-layer Interconnects in Flip Chip Packages

Uchibori, Chihiro J., Zhang, Xuefeng, Im, Sehyuk, Ho, Paul S., Nakamura, Tomoji

Année:

2007

Langue:

english

Fichier:

PDF, 428 KB

english, 2007

11

[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Investigation of Interconnect Design on Chip Package Interaction and Mechanical Reliability of Cu/Low-k Multi-Layer Interconnects in Flip Chip Package

Uchibori, Chihiro J., Zhang, Xuefeng, Ho, Paul S., Nakamura, Tomoji

Année:

2008

Langue:

english

Fichier:

PDF, 537 KB

english, 2008

12

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Solder crack simulation using SPH particle method with submodeling technique

Uchibori, Chihiro J., Sakuyama, Seiki, Sakai, Yuzuru, Su-I, Thyon, Watanabe, Takayuki, Yamagata, Nobuki

Année:

2014

Langue:

english

Fichier:

PDF, 771 KB

english, 2014

13

[IEEE 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Tokyo, Japan (2010.08.24-2010.08.26)] 2010 IEEE CPMT Symposium Japan - Thermal stress analysis of FCBGA during cooling under reflow process

Uchibori, Chihiro J., Lee, Michael

Année:

2010

Langue:

english

Fichier:

PDF, 538 KB

english, 2010

14

[IEEE 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT) - Beijing, China (2008.10.20-2008.10.23)] 2008 9th International Conference on Solid-State and Integrated-Circuit Technology - Chip Package Interaction and mechanical reliability impact on Cu/ultra low-k interconnects in Flip Chip package

Uchibori, Chihiro J., Xuefeng Zhang,, Ho, Paul S., Nakamura, T.

Année:

2008

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2008

15

[IEEE 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Shanghai, China (2006.10.23-2006.10.26)] 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Impact of chip-package interaction on reliability of Cu/ultra low-k interconnects for 65nm technology and beyond

Uchibori, Chihiro, Zhang, Xuefeng, Ho, Paul, Nakamura, Tomoji

Année:

2006

Langue:

english

Fichier:

PDF, 340 KB

english, 2006

16

Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure

Mizushima, Yoriko, Kitada, Hideki, Uchibori, Chihiro J., Maeda, Nobuhide, Kodama, Shoichi, Kim, Youngsuk, Fujimoto, Koji, Yoshimi, Seiichi, Nakamura, Tomoji, Ohba, Takayuki

Journal:

Japanese Journal of Applied Physics

Année:

2013

Langue:

english

Fichier:

PDF, 429 KB

english, 2013

17

[AIP Stress-induced Phenomena in Metallization - ()] AIP Conference Proceedings - Effects of Chip-Package Interaction on Mechanical Reliability of Cu Interconnects

UCHIBORI, Chihiro J., Xhang, Xuefeng, Im, Sehyuk, Ho, Paul S., Nakamura, Tomoji, Ogawa, Shinichi, Ho, Paul S., Zschech, Ehrenfried

Année:

2007

Langue:

english

Fichier:

PDF, 2.13 MB

english, 2007

18

Association of Acute Cerebellar Ataxia and Human Papilloma Virus Vaccination: A Case Report

Yonee, Chihiro, Toyoshima, Mitsuo, Maegaki, Yoshihiro, Kodama, Yuichi, Hayami, Hiroshi, Takahashi, Yukitoshi, Kusunoki, Susumu, Uchibori, Ayumi, Chiba, Atsuro, Kawano, Yoshifumi

Journal:

Neuropediatrics

Année:

2013

Langue:

english

Fichier:

PDF, 69 KB

english, 2013

19

Development of Contact Materials for Semiconductor Devices. Recent Progress in Contact Materials for GaAs Devices.

Oku, Takeo, Uchibori, Chihiro, Murakami, Masanori

Journal:

Année:

1994

Fichier:

PDF, 1.56 MB

1994

20

Effects of deposition sequence on electrical properties of InAs–Ni–W Ohmic contacts to n-type GaAs

Uchibori, Chihiro J., Oku, T., Kameya, N., Ono, N., Murakami, M.

Journal:

Materials Transactions, JIM

Année:

1996

Fichier:

PDF, 998 KB

1996

21

Development of Thermally Stable Ohmic Contacts to h-type GaAs.

Uchibori, Chihiro, Oku, Takeo, Otsuki, Akira, Murakami, Masanori

Journal:

Année:

1994

Fichier:

PDF, 1.75 MB

1994